Thermal Compound

Thermal Compound Benchmark

Tested Products

BrandModelThermal Conductivity (W/mK)Weight (g)Temperature Difference (°C)Review Score
NoctuaNT-H2N/A3.5 / 1050.184
ThermalrightTFX14.32 / 6.250.576
NoctuaNT-H1N/A3.5 / 1051.27N/A
GELIDGC Extreme8.53.553.87N/A
  • “Thermal Conductivity” data is provided by the manufacturers.
  • “Temperature Difference” is an average of our benchmark results.
  • “Review Score” is an average of the three categories (Unboxing, Performance, Value).

Testing Methodology

To find out the performance for each thermal compound, a total of three benchmarks are included. AIDA64 is used to run a CPU stress test. CPU, FPU and system cache are all stressed to create as much heat output as possible. Also, Cinebench R15 and Cinebench R20 are used to simulate real-world CPU load (like video-editing or rendering). They will be run continuously for three times. The highest CPU package temperatures are recorded. Results will be taken at 100% fan speed, controlled via the motherboard CPU PWM fan header. Only single-fan configuration will be used in the benchmark.

TestbenchVersion 1Version 2
CPUAMD Ryzen 5 1600X @ 3.6 GHz (95W TDP)Intel Core i7-9700K @ 4.80 GHz @ 1.30 V (~150W TDP)
CPU CoolerNoctua NH-U12S (its review here)Noctua NH-U12S (its review here)
MotherboardMSI B350M GAMING PRO (its review here)ASRock Z370 Killer SLI

Our Benchmarking Results

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Check out our full reviews for more detailed explanations and analysis.